电镀与精饰2024,Vol.46Issue(4) :81-89.DOI:10.3969/j.issn.1001-3849.2024.04.012

响应面法优化铜箔工艺参数的研究

Study on optimization of copper foil process parameters by response surface method

王庆福 王绪军 樊斌锋 李谋翠
电镀与精饰2024,Vol.46Issue(4) :81-89.DOI:10.3969/j.issn.1001-3849.2024.04.012

响应面法优化铜箔工艺参数的研究

Study on optimization of copper foil process parameters by response surface method

王庆福 1王绪军 1樊斌锋 1李谋翠1
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作者信息

  • 1. 河南高精铜箔产业技术研究院有限公司,河南灵宝 472500
  • 折叠

摘要

通过单因素及响应面试验优化铜箔生产工艺参数对铜箔抗拉强度及延伸率的影响.结果发现,响应面优化最佳工艺条件为温度60℃,电流密度65 A/dm2,上液流量为55 m3/h,且各因素对抗拉强度的影响大小为电流密度>温度>上液流量,对延伸率的影响大小为温度>电流密度>上液流量,其中温度和电流密度对铜箔抗拉强度的交互作用显著,最优工艺条件下制备的铜箔(111)晶面的衍射强度最大,织构系数为46.9%,具有明显的择优取向.

Abstract

The effects of copper foil production process parameters on tensile strength and elongation of copper foil were optimized by single factor and response surface test. The results show that the optimal process conditions for the optimization of the response surface are temperature of 60 ℃, current density of 65 A/dm2, liquid flow of 55 m3/h, and the influence of each factor on tensile strength is current densi-ty> temperature > liquid flow, and the influence on elongation is temperature> current density > liquid flow, in which the interaction between temperature and current density on the tensile strength of copper foil is significant. In addition, the crystal face of copper foil (111) prepared under optimal process con-ditions has the largest diffraction intensity and a texture coefficient of 46.9%, which has an obvious preference orientation.

关键词

铜箔/抗拉强度/延伸率/工艺参数/响应面法

Key words

copper foil/tensile strength/elongation/process parameters/response surface method

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出版年

2024
电镀与精饰
天津市电镀工程学会

电镀与精饰

CSTPCD北大核心
影响因子:0.522
ISSN:1001-3849
参考文献量18
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