Influence and mechanism of new leveler on through hole filling by copper electroplating
To solve the bottlenecks of the specialized chemicals for electronic electroplating in domes-tic,a new leveler named SC-21 was synthesized.It was consisted of a nitrogen-containing heterocycle and an oxygen-containing carbon chain.In this paper,the different performances between the common leveler of Janus Green B(JGB),polyethyleneimine alkyl salt(PN)and the new leveler SC-21 were studied by copper plating in haring cell,cyclic voltammetry(CV),chronopotentiometry(CP&CP-CR),and electrochemical impedance spectroscopy(EIS).The results indicate that the copper deposi-tion mode of"butterfly filling"can be achieved using a certain concentration of SC-21 as the leveler.Fi-nally,the through holes with the depth to ratio of 2∶1 can be completely filled without void.Compared with JGB and PN,SC-21 at this concentration showed a dynamic adsorption behavior in a wide range of current density,which resulted in the appearance of"negative differential resistance effect"(NDR ef-fect).The NDR effect can lead to the velocity gradients of copper deposition in the through hole,which finally resulted in the void-free filling of through holes.
through hole fillinglevelerbutterfly technologychronopotentiometry with current rampnegative differential resistance effect
NETL
NSTL
万方数据
