首页|硫酸钛-钨酸钠复合添加剂对电解铜箔后处理形貌及抗剥离强度的影响

硫酸钛-钨酸钠复合添加剂对电解铜箔后处理形貌及抗剥离强度的影响

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随着电子信息技术的高速发展,高端且精细的电子产品日益增多,对印制电路板(PCB)用电路板铜箔提出了更高的要求,要求铜箔兼有低粗糙度和高抗剥离强度.针对此问题,采用调控电解铜箔后处理添加剂含量的方法,研究了后处理添加剂对铜箔抗剥离强度的影响.采用预处理过的毛箔,在自制的方形电解槽中通直流电,用配制的不同粗化电解液进行微粗化试验.结果表明:硫酸钛浓度增高,铜箔表面瘤点状颗粒的成核趋势会增大.当浓度为0.7 g/L时,抑制晶粒成核,表面粗糙度先降低后升高.0.3 g/L的硫酸钛可以更好的促进成核,抑制晶粒生长,提高抗剥离强度.加入0.05 g/L钨酸钠和0.3 g/L硫酸钛时,深镀能力最优,其抗剥离性能最高可达到0.7 N/mm.与单纯的钨酸钠体系相比,铜箔的抗剥离强度提高了约30.7%,粗糙度提高了约1.9%.钨酸钠和硫酸钛复合会起到一定的深镀能力,随着钨酸钠的加入,铜箔的抗剥落强度提升,粗糙度呈现下降趋势.
Effect of titanium sulfate and sodium tungstate composite additive on morphology and performance of electrolytic copper foil posttreatment
With the rapid development of electronic information technology,premium and fine electron-ic products are increasing,which puts higher requirements on copper foil for printed circuit boards(PCBs),requiring both low roughness and high peel strength.To address this issue,a method involv-ing the post-treatment of electrolytic copper foil with controlled additions of additives was used to study the impact of post-treatment additives on the peel strength of copper foils.In the study,pretreated rough copper foil was used,and a DC current was applied in a custom-made square electrolytic cell for micro-roughening tests using various roughening electrolytes.The results indicate that as the concentration of titanium sulfate increases,the nucleation tendency of nodular particles on the copper foil surface in-creases.When the concentration is 0.7 g/L,it inhibits grain nucleation,causing surface roughness to initially decrease and then increase.An optimal concentration for promoting nucleation and inhibiting grain growth is found at 0.3 g/L of titanium sulfate.When 0.05 g/L of sodium tungstate and 0.3 g/L of ti-tanium sulfate are added,the deep plating capability is optimized,and the peel strength of copper foil reaches a maximum of 0.7 N/mm.This represents a 30.7%improvement in peel strength compared to the sodium tungstate system alone,and roughness increases by approximately 1.9%.In conclusion,the combination of sodium tungstate and titanium sulfate does enhance the deep plating capability.The addi-tion of sodium tungstate in the post-treatment process improves the peel strength of copper foils,while roughness exhibits a decreasing trend.

electrolytic copper foilpost-treatmentadditivesmicro-morphologyanti-stripping prop-ertieselectrochemical properties

张锦园、张杰、白忠波、彭肖林、刘二勇、张菁丽、焦阳

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西安科技大学 材料科学与工程学院,陕西 西安 710054

南京龙电华鑫新能源材料产业技术研究院有限公司,江苏 南京 211200

灵宝华鑫铜箔有限责任公司,河南灵宝 472599

陕煤集团神南产业发展有限公司,陕西 榆林 719300

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电解铜箔 后处理 添加剂 微观形貌 抗剥离性能 电化学性能

陕西省重点研发计划陕西省自然科学基础研究计划国家自然科学基金国家自然科学基金陕西省教育厅服务地方专项

2021SF-4692023-JC-QN-0507521751845180544223JC051

2024

10.3969/j.issn.1001-3849.2024.05.014

电镀与精饰
天津市电镀工程学会

电镀与精饰

CSTPCD北大核心
影响因子：0.522
ISSN：1001-3849
年,卷(期)：2024.46(5)
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