The influence of high-frequency and high-speed copper foil indicators of different manufacturers on the resistance to peel strength
With the continuous development of 5G information technology,higher requirements and newer specifications have been put forward for its high-frequency and high-speed electrolytic copper foil for 5G.At present,there are two types of electrolytic copper foils for hard boards produced in China:reversed copper foil(RTF)and ultra-low profile copper foil(HVLP).A batch of reversed copper foil(12RTF)with a thickness of 12 μm from six different manufacturers at home and abroad and a batch of ultra-low profile copper foil(12HVLP)with a thickness of 12 μm from two different manufacturers were tested randomly.The microscopic morphology of the coarse-treated and untreated surfaces,copper foil mass per unit area,tensile strength,elongation,roughness,peel strength and oxidation resistance were compared and the samples were tested for compliance.The results showed that the peel strength of RTF was directly related to the appearance of the roughened layer,and the peel strength of HVLP was closely related to the increase of the profile.The research results would provide a certain basis for improving the peel resistance of high-frequency and high-speed copper foil in production.
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