Analysis and solution of gold creeping defects in electroplating of alumina ceramic package shell
Aiming at the gold creeping defects after plating of ceramic package shells of soldered frame lead type,the ceramic shells before plating were analyzed by scanning electron microscope and energy spectrometer.The results showed that tungsten powder and solder were introduced onto the ceramic surface during the sintering and brazing processes,respectively,and could not be screened for removal under the microscope,resulting in gold creeping after electroplating.After increasing the cleaning of the sintering tool and the pretreatment of the plating and annealing,the gold creeping defects in the plating were effectively eliminated.
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