氧化铝陶瓷封装外壳电镀爬金缺陷分析与解决
Analysis and solution of gold creeping defects in electroplating of alumina ceramic package shell
刘朋 1张浩宇 1向雪凤 1张馨 1何允鹏 1杜支波 1康建宏1
作者信息
- 1. 成都宏科电子科技有限公司,四川 成都 610100
- 折叠
摘要
针对焊接框架引线类陶瓷封装外壳电镀后爬金缺陷,采用扫描电子显微镜和能谱仪对电镀前的陶瓷外壳进行了分析.结果表明,在烧结和钎焊过程分别在陶瓷表面上引入了钨粉和焊料,在显微镜下无法筛选去除导致电镀后爬金.在增加了烧结工装的清洗和电镀前处理以及退火后,爬金缺陷得到有效解决.
Abstract
Aiming at the gold creeping defects after plating of ceramic package shells of soldered frame lead type,the ceramic shells before plating were analyzed by scanning electron microscope and energy spectrometer.The results showed that tungsten powder and solder were introduced onto the ceramic surface during the sintering and brazing processes,respectively,and could not be screened for removal under the microscope,resulting in gold creeping after electroplating.After increasing the cleaning of the sintering tool and the pretreatment of the plating and annealing,the gold creeping defects in the plating were effectively eliminated.
关键词
陶瓷封装外壳/电镀/爬金/钎焊/缺陷Key words
ceramic package housing/electroplating/gold creeping/brazing/defects引用本文复制引用
出版年
2024
NETL
NSTL
万方数据