Effect of chloride ions on copper electrodeposition in local electrochemistry
Local electrochemical deposition(LECD)is a very convenient and economical method for manufacturing metal microstructures.The effects of Cl-concentration on the morphology,diameter and deposition rate of copper microcolumn on LECD are studied by a microanode with a diameter of 20 μm.Cl-causes the reduction process of copper ions to become cuprous ions,and then to be reduced to copper.Cl-has the effect of accelerating the deposition of copper microcolumns,thereby regulating the morphology and improving deposition efficiency of copper microcolumn.It also causes the cuprous chloride to cover the surface of copper microcolumn.Due to the disproportion reaction of cuprous chloride,pores and rough morphology are formed on the surface,and the cuprous chloride crystals also increase the diameter of copper microcolumn.Because of high current density and high hydrogen ion concentration,cuprous chloride cannot be formed inside the copper microcolumn.The effect of Cl-concentration on the morphology and deposition rate of copper microcolumn provides a reference for the synergistic application of Cl-and other additives on LECD.
local electrochemical deposition(LECD)Cl-concentrationcopper microcolumnmor-phologydeposition rate
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