Preparation of silver powder by chemical reduction method and its application in conductive adhesive
The purpose of this study is to prepare silver powder using chemical reduction method,and to investigate the influence mechanism of Ag+concentration,reduction liquid droplet addition method,and dispersion system on the morphology of silver powder during the preparation process,in order to obtain a suitable silver powder for the preparation of conductive adhesive.The method used is to prepare silver powder using silver nitrate as the silver source.Gelatin,arabic gum,and a mixture of polyvinyl pyrrolidone(PVP)and gelatin are used as dispersants to study the effects of different dispersion systems on the morphology and particle size of silver powder.The results showed that the particle size of silver powder showed an increasing trend with the increase of Ag+concentration in the solution;The morphology of silver powder prepared by different dispersion systems varies greatly,while the particle size difference is not significant.The silver powder prepared by one-time addition has a larger particle size distribution range.The silver powder prepared with gelatin as the dispersant is in a regular spherical shape,while the silver powder prepared with arabic gum as the dispersant is in a regular cluster shape.The silver powder prepared with a mixed system of PVP and gelatin as the dispersant has a mixture of spherical and sheet-like morphology.In addition,the particle size of silver powder shows a gradually increasing trend with the increase of reaction temperature.The most suitable silver powder for the preparation of conductive adhesive is spherical silver powder prepared using Arabic gelatin monodisperse system.The conclusion drawn is that the concentration of Ag+in the solution,the method of adding reducing solution droplets,and the dispersion system all have varying degrees of influence on the morphology and particle size of silver powder during the preparation of silver powder by chemical reduction method.The volume resistivity of conductive adhesive prepared with different morphologies of silver powder varies.
silver powdermorphology and particle sizedispersion systemconductive adhesivevolume resistivity
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