Effect of additive HP in combination additives on the organizational properties of electrolytic copper foils
Electrolytic copper foil has the characteristics of simple process,good mechanical properties such as conductivity and thermal conductivity,which has become an important basic raw material for the modern electronics industry.In this study,the effects of different HP concentrations on the surface micro-morphology,tensile strength and other physical properties of copper foils were investigated using DC electrodeposition with a certain amount of sodium alcohol thiopropane sulfonate(HP),polyethylene glycol(PEG),sodium polydithiodipropane sulfonate(SPS),sodium saccharin(BSI)and collagen as the composite additives.The results showed that HP can synergize with other additives in the combined additives in a suitable concentration range to improve the optimal orientation of the(200)and(220)grain surfaces,thus effectively refining the grains and reducing the roughness.The tensile strength and elongation of the prepared copper foils reached 634.1 MPa and 4.1％,respectively,when the concentration of HP in the combined additives was 6 mg·L-1.
万方数据
维普
