Large residual defects were found on the surface of the wafer in aluminum interconnection process,which were confirmed as photoresist by component analysis.It was found that changing the coating process can improve the residual situation of photoresist by process inspections on coating,lithography,corrosion and removing of photoresist.The results show that the surface morphology of the aluminum film is closely related to the photoresist residual.The residuals can be improved by reducing the surface roughness of the film.
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