Research on the bondability of roughen pre-electroplated lead frame
Using technical validation and statistical testing methods,a self-developed electrochemical deposition solution for electroplating rough nickel was used to prepare a roughened pre-electroplated lead frame product,and the influencing factors of the product's bonding performance were studied.The research results indicate that by optimizing the dispersant content in the electrochemical deposition solution for rough nickel and the thickness of the gold layer,palladium layer and nickel layer,the bondability of the roughened pre-electroplated lead frames can be significantly improved.The bonding performance of the prepared roughened pre-electroplated lead frame products fully meets the application requirements in the industry,and it is expected to achieve domestic substitution of such products.
万方数据
维普
