印制线路板酸性镀铜整平剂的研究
Study on a leveling agent for acidic copper plating of printed circuit board
厉小雯 1唐有根 1罗玉良 2康东红1
作者信息
- 1. 中南大学化学化工学院化学电源与材料研究所,湖南,长沙,410083
- 2. 东莞钰利电子材料有限公司,广东,东莞,523050
- 折叠
摘要
以N-乙烯基咪唑和1,4-丁二醇二环氧甘油醚为原料合成了一种带聚醚链的整平剂,采用FT-IR和<'1>H NMR对其结构进行了表征.对由此整平剂与聚二硫二丙烷磺酸钠(SPS)和聚乙二醇(PEG-6000)组成的添加剂体系与市售整平性能较好的添加剂的阴极极化曲线、铜镀层表面形貌和镀液均镀能力作了对比.结果表明,含此整平剂的添加剂在细化颗粒能力和均镀能力方面均比市售添加剂好,并能在较宽的电流密度范围内(0.6～10A/dm<'2>)得到光亮的铜镀层.该整平剂可作为一种性能良好的添加剂应用于印制线路板(PCB)酸性镀铜工艺.
Abstract
A leveling agent with polyether chain was synthesized with N-vinylimidazole and 1,4--butanediol diglycidyl ether as raw materials. The structure of the leveling agent was characterized by FT-IR and tH NMR spectroscopy.Cathodic polarization curves, surface morphologies of copper deposit and throwing power of plating bath were compared between the additive system containing the leveling agent,sodium 3,3′-dithiobis- 1 -propanesulfonate (SPS) and polyethylene glycol (PEG-6000), and a commercial additive with good leveling property. Results indicated that the ability for refining particle size and the throwing power of the additive system containing the leveling agent is better than that of the commercial additive, and a bright copper deposit can be obtained in a wide range of current densities (0.6-10 A/dm2) by using the leveling agent. As an additive with good performance, the leveling agent can be applied to acidic copper plating of printed circuit boards (PCBs).
关键词
酸性镀铜/印制线路板/整平剂/均镀能力Key words
acidic copper plating/printed circuit board/leveling agent/throwing power引用本文复制引用
出版年
2011
NETL
NSTL
维普
万方数据