Electroless copper plating on polyethylene glycol-modified PET film
The effect of polyethylene glycol (PEG-6000) modification of polyethylene terephthalate (PET) film on electroless copper plating on its surface was studied. The process flow mainly consists of: (a) successive polishing of PET film with 1#, 3# and 5# metallographic sand paper; (b) modification of PET film by grafting with PEG; and (c) electroless copper plating from a bath containing CuSO4·5H2O 16 g/L, Na2EDTA 14 g/L, NaKC4H4O6·2H2O 19.5 g/L, NaOH 14.5 g/L, and HCHO 15 mL/L at temperature 40 ℃ for 30 min. The infrared spectra show that PEG-6000 are grafted successfully to the surface of PET film. The structure and surface morphology of PET film before and after electroless copper plating were analyzed by X-ray diffractometer and scanning electron microscope, respectively, and the properties of PET film such as adhesion strength, thickness, and conductivity were tested. The results show that the electroless copper coating on PET film is highly pure. Compared to the copper coating on ungrafted PET substrate, the copper coating on grafted PET substrate is fine-grained and bright. The electrolessly plated copper coating on PEG-modified PET film features a thickness of 1.21 μm, a conductivity of 1.9 × 105 S/cm, a backlight level of 10 grade, and an adhesion strength of 16.1 N/cm, being able to be used to produce flexible circuit boards (FCBs).
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