添加剂对印制线路板微盲孔填铜效果的影响
Effects of additives on microvia copper-filling efficiency of printed circuit board
唐明星 1张胜涛 1陈世金 2强玉杰 1罗莉 1何为 3高箐遥 3秦中建 1郭茂桂2
作者信息
- 1. 重庆大学化学化工学院,重庆401331
- 2. 博敏电子股份有限公司,广东梅州514000
- 3. 电子科技大学微电子与固体电子学院,四川成都610054
- 折叠
摘要
在电流密度1.94 A/dm2、温度25℃和空气搅拌的条件下,采用由220 g/L CuSO4·5H2O、0.54 mol/L H2SO4和4种添加剂组成的酸性镀铜液对PCB(印制线路板)微盲孔进行填充.所用添加剂包含C1-、加速剂(聚二硫二丙烷磺酸钠,SPS)、抑制剂(聚乙二醇-8000,PEG-8000)和整平剂(4,6-二甲基-2-巯基嘧啶,DMP).通过电化学阻抗谱和阴极极化曲线分析了上述4种添加剂的用量对微盲孔填充效果的影响.结果表明:当C1-为30～60 mg/L、SPS为0.5 ～ 1.0 mg/L,PEG-8000为100 ～ 300mg/L、DMP为1～7 mg/L时,填孔效率最佳,所得镀层表面结构均匀、致密,耐浸锡热冲击和抗高低温循环的性能良好,满足PCB的可靠性要求.
Abstract
Microvia of PCB (print circuit board) was filled by electroplating in an acid bath composed of 220 g/L CuSO4·5H2O,0.54 mol/L H2SO4 and four kinds of additives at temperature 25 ℃ and current density 1.94 A/dn2 under air agitation.The employed additives are Cl-,sodium 3,3'-dithiodipropane sulfonate (SPS,as accelerator),polyethylene glycol (PEG-8000,as inhibitor) and 4,6-dimethyl-2-mercaptopyrimidine (DMP,as leveler).The effects of the dosages of the above mentioned additives on microvia-filling efficiency were analyzed by electrochemical impedance spectroscopy and cathodic polarization measurement.The results showed that the microvia-filling efficiency is the best when the mass concentrations of C1,accelerator,inhibitor and leveler are 30-60 mg/L,0.5-1.0 mg/L,100-300 mg/L and 1-7 mg/L respectively.The obtained coating is uniform and compact,and has good resistance to thermal shock in tin immersion and temperature cycling tests,meeting the requirement of reliability for PCB application.
关键词
印制线路板/微盲孔/添加剂/填孔率/电化学/可靠性Key words
printed circuit board/microvia/additive/filling ratio/electrochemistry/reliability引用本文复制引用
基金项目
国家自然科学基金(21376282)
广东省“扬帆计划”先进印制电路关键技术研发及产业化项目(2015YT02D025)
汽车电子用高密度智能控制印制电路关键技术及产业化项目(2015B090901032)
出版年
2017
NETL
NSTL
维普
万方数据