[Introduction]In order to understand the dynamic process of meniscus-confined electrodeposition of copper,a two-dimensional axisymmetric model for copper electrodeposition in a copper sulfate solution was established.[Method]The meniscus-confined electrodeposition of copper was simulated with COMSOL finite element software in consideration of the synergy of multiple physical fields.The effects of environmental relative humidity,voltage,and electrodeposition time on dynamic electrodeposition of copper were studied.[Result]The relative humidity of the environment affects the evaporation flux and ion flux,while the applied voltage has an impact on the quality and efficiency of copper electrodeposition by changing the cathode overpotential.With the extending of electrodeposition time,the copper deposition rate at the edge of the meniscus is higher than that of at the center,resulting in an edge-preferred growth.[Conclusion]The quality and efficiency of copper electrodeposition can be optimized by adjusting the process parameters of meniscus-confined electrodeposition.
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