A composite additive for electroplating composite copper foil
[Introduction]Composite copper foil is a novel key material for current collector of negative electrode of lithium-based battery,and the additives used in copper electroplating for its preparation has become the focus of research.[Method]The accelerator,inhibitor,and leveling agent of sulfate-based copper electroplating were selected by Hull cell test and electrochemical analysis,and then electroplating tests were conducted under the simulated on-site environment to determine the most suitable combination of the additives.[Result]The optimized additive composition was as follows:sodium 3,3′-dithiodipropane sulfonate(SPS)2 mg/L,modified polyethylene glycol 100 mg/L,and leveling agent C(a kind of thioureido-imidazoline quaternary ammonium salt)1 mg/L.A copper coating with a thickness of 1-2 μm could be obtained on both sides of an ultrathin polymer film by electroplating with the given composite additive.The obtained composite foil was normal in appearance and warp-free with a total thickness of 6 μm,and had high tensile strength(292.39-297.98 MPa)and elongation at break(21.34%to 22.68%).[Conclusion]The composite additive given above is expected to be applied to the preparation of composite copper foil with high tensile strength and high elongation,and has a good industrial application prospect.
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