Effect of sealing of anodic oxidation film on properties of aluminum-based copper clad laminate
[Introduction]The effect of anodizing and sealing of aluminum substrate on the properties of copper clad laminates.[Method]The 7075 aluminum alloy was initially anodized with oxalic acid,and then sealed with Al2O3 sol or/and ZnO sol under vacuum,and finally cured at 300 ℃.The effects of sealing with Al2O3 sol,ZnO sol or both of them,and sealing time on the thermal conductivity and withstanding voltage of anodic oxidation film were studied.Copper clad laminates were also prepared using the anodized and sealed aluminum alloy as substrate by magnetron sputtering or thermal compression bonding with copper.[Result]After being sealed with Al2O3 sol and ZnO sol alternatively for 4 times,the withstanding voltage of anodic oxidation film was increased by about 2.90 times,but the thermal conductivity was slightly decreased.The copper clad laminate prepared by magnetron sputtering copper featured a peeling strength up to 1.15 N/mm and excellent thermal resistance.[Conclusion]Anodization and sealing of aluminum-based substrate can greatly improve the properties of copper clad laminate.
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