Reason analysis on bonding failure between microwave multi-cavity shell and copper clad laminate with conductive adhesive and countermeasures
[Introduction]A microwave multi-cavity shell made of Kovar alloy and plated with nickel and gold needs to be bonded with copper clad laminate(CCL)by using the conductive adhesive.Some problems such as non-wetting and cracking of conductive adhesive and peeling of copper clad laminate(CCL)from the cavity shell appeared.[Method]The possible causes for these problems were determined by fault tree analysis and verified one by one through energy-dispersive spectroscopic analysis,water droplet test,and shearing test.[Result]One of the two main reasons for the conductive adhesive bonding failure was the improper parameters during immersion in gold protective agent after gold plating,and the other one was that the shell surface was contaminated with a trace amount of silicone oil(a mold releasing agent)from the package box during transportation.[Conclusion]No bonding failure occurred after conducting a chemical cleaning procedure for the microwave multi-cavity shell prior to conductive adhesive bonding and avoiding the use of silicone oil-containing boxes.