首页|微波多腔体外壳导电胶粘接覆铜板失效原因分析与解决

微波多腔体外壳导电胶粘接覆铜板失效原因分析与解决

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[目的]某微波多腔体外壳(可伐材料)镀镍/金后,在通过导电胶粘接覆铜板时出现导电胶与可伐腔体不浸润、导电胶开裂、覆铜板从可伐腔体外壳上剥离等不良现象.[方法]通过建立故障树,结合能谱分析、水滴试验和剪切力测试,对上述问题的主要影响因素逐一进行分析.[结果]导电胶粘接失效的主要原因是镀金后浸泡金保护剂工艺参数不当,以及转运过程中所用包装盒上的微量硅油沾污了外壳表面.[结论]在导电胶粘接前对微波多腔体外壳进行化学清洗,以及禁用含硅油的包装盒后,未再出现粘接失效现象.
Reason analysis on bonding failure between microwave multi-cavity shell and copper clad laminate with conductive adhesive and countermeasures
[Introduction]A microwave multi-cavity shell made of Kovar alloy and plated with nickel and gold needs to be bonded with copper clad laminate(CCL)by using the conductive adhesive.Some problems such as non-wetting and cracking of conductive adhesive and peeling of copper clad laminate(CCL)from the cavity shell appeared.[Method]The possible causes for these problems were determined by fault tree analysis and verified one by one through energy-dispersive spectroscopic analysis,water droplet test,and shearing test.[Result]One of the two main reasons for the conductive adhesive bonding failure was the improper parameters during immersion in gold protective agent after gold plating,and the other one was that the shell surface was contaminated with a trace amount of silicone oil(a mold releasing agent)from the package box during transportation.[Conclusion]No bonding failure occurred after conducting a chemical cleaning procedure for the microwave multi-cavity shell prior to conductive adhesive bonding and avoiding the use of silicone oil-containing boxes.

microwave multi-cavity shellconductive adhesivecopper clad laminatebonding failuretroubleshooting

解瑞、刘海、杨建、程凯、刘思栋、陈子灵

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南京固体器件有限公司,江苏 南京 210016

中国电子科技集团公司第55研究所,江苏 南京 210016

江苏省南京市第五高级中学,江苏 南京 210004

微波多腔体外壳 导电胶 覆铜板 粘接失效 故障处理

江苏省科技厅重点研发计划项目

BE2022070

2024

电镀与涂饰
广州市二轻工业科学技术研究所

电镀与涂饰

CSTPCD北大核心
影响因子:0.47
ISSN:1004-227X
年,卷(期):2024.43(4)
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