Synthesis of a pyridyl-containing imidazole derivative and its application in organic solderability preservative
[Introduction]The water solubility of imidazole and its derivatives is poor,and the organic solderability preservative(OSP)solutions prepared from them is unstable,as shown by easy occurrence of turbidity or precipitation of insolubles.[Method]A pyridyl-containing imidazole derivative named 2-(2,6-dichloro-4-pyridyl)-4-phenyl-5-methylimidazole(DPN)was synthesized from 3,5-dichloropyridin-4-formaldehyde and 1-phenyl-1,2-malondialone,and then used as the main film-forming agent for OSP.The structure of DPN was characterized by gas chromatography-mass spectrometry(GC-MS),nuclear magnetic resonance spectroscopy(NMR),and Fourier-transform infrared spectroscopy(FT-IR).The corrosion resistance,thermal resistance,and weldability of the DPN-based OSP film were examined by immersion corrosion test,electrochemical analysis,thermogravimetry,reflow soldering test,and edge dip test.[Result]The synthesized DPN had good water solubility,which is beneficial to improve the stability of OSP.The effective adsorption and film formation of DPN on the copper surface not only can protect the copper from corrosion effectively,but also enable the copper excellent thermal resistance and weldability.[Conclusion]DPN can be used as the main film-forming agent of OSP in manufacturing of printed circuit boards.
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