印制电路板盲孔填充电镀铜添加剂的研究进展
Research progress of additives for blind-via filling on printed circuit board by copper electroplating
何念 1连纯燕 1潘炎明 1王健 1冯朝辉 1段小龙1
作者信息
- 1. 广东利尔化学有限公司,广东 广州 510000
- 折叠
摘要
[目的]电子产品日益追求轻量化和微型化,这促使印制电路板(PCB)制造向更高精度、更高密度及更小孔径的方向发展.盲孔电镀填充是PCB制造的关键工艺之一.在酸性电镀铜溶液中添加抑制剂、光亮剂、整平剂等添加剂,可借助它们之间的协同效应来实现盲孔的超等角填充.[方法]综述了电镀铜抑制剂、光亮剂和整平剂的研究现状,探讨了它们的作用机制与协同效应,展望了未来的研究方向.[结果]使用适当的添加剂可实现盲孔"自下而上"的超等角填充.[结论]加强电镀铜添加剂的研究和开发可为PCB产业的持续发展提供有力的技术支撑.
Abstract
[Introduction]The increasing pursuit of lightweight and miniaturization of electronic products has led to the development of printed circuit board(PCB)manufacturing in direction of higher precision,higher density,and smaller aperture.Blind-via filling by copper electroplating is one of the key processes in PCB manufacturing.Bottom-up filling of bind-via can be achieved by adding additives with good synergistic effects such as inhibitor,brightener,and leveling agent to the acid copper electroplating bath.[Method]The research progress of inhibitors,brighteners,and leveling agent for copper electroplating was reviewed.The action mechanisms and synergistic effects of different additives during copper electroplating were discussed.The future research directions were proposed.[Result]Bottom-up filling of blind-via can be achieved by proper use of additives.[Conclusion]It is important to strengthen the research and development of additives for copper electroplating to provide strong technical support for the sustainable development of PCB industry.
关键词
印制电路板/盲孔/电镀铜/添加剂/超等角沉积/综述Key words
printed circuit board/blind-via/copper electroplating/additive/bottom-up filling/review引用本文复制引用
出版年
2024
NETL
NSTL
万方数据