Research progress of additives for blind-via filling on printed circuit board by copper electroplating
[Introduction]The increasing pursuit of lightweight and miniaturization of electronic products has led to the development of printed circuit board(PCB)manufacturing in direction of higher precision,higher density,and smaller aperture.Blind-via filling by copper electroplating is one of the key processes in PCB manufacturing.Bottom-up filling of bind-via can be achieved by adding additives with good synergistic effects such as inhibitor,brightener,and leveling agent to the acid copper electroplating bath.[Method]The research progress of inhibitors,brighteners,and leveling agent for copper electroplating was reviewed.The action mechanisms and synergistic effects of different additives during copper electroplating were discussed.The future research directions were proposed.[Result]Bottom-up filling of blind-via can be achieved by proper use of additives.[Conclusion]It is important to strengthen the research and development of additives for copper electroplating to provide strong technical support for the sustainable development of PCB industry.
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