首页|铜-锌合金电沉积及脱合金化法制备多孔铜箔

铜-锌合金电沉积及脱合金化法制备多孔铜箔

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[目的]纳米多孔铜由于其开放的多孔结构、较高的比表面积、较低的密度等独特的理化性能,在储能、催化剂、传感器等领域有巨大的应用潜力.为了解决金属锂作为锂离子电池负极材料时存在的锂枝晶及安全问题,采用脱合金化法制备多孔铜箔成为近年来的研究热点.[方法]先以钛板为基体电沉积铜箔基底,接着电沉积Cu-Zn合金,再脱合金化处理得到多孔铜箔.重点研究了工艺参数对Cu-Zn合金镀层形貌、结构和性能的影响.[结果]Cu-Zn合金电沉积的较优工艺条件为:电流密度1.0 A/dm2,温度40 ℃,时间20 min.该条件下所得Cu-Zn合金镀层表面平整、结构均匀、形成单一合金相,经脱合金化处理后Zn元素的去除率为70.6%.[结论]采用电沉积+脱合金化的方法有望制得孔径均匀的多孔铜箔,但会产生裂纹,有待进一步研究和改善.
Preparation of porous copper foil by copper-zinc alloy electrodeposition and dealloying
[Introduction]Nanoporous copper has great potential for applications in energy storage,catalyst,sensor,and other fields due to its unique physicochemical properties i.e.open porous structure,high specific surface area,and low density.In order to solve the problems such as lithium dendrite and low safety existing in lithium-ion batteries using lithium as anode material,the preparation of porous copper foil by dealloying method has become a hot research topic in recent years.[Method]A porous copper foil was obtained by electrodepositing of copper foil based on a titanium plate,followed by electrodeposition of Cu-Zn alloy,and then dealloying.The effects of different process parameters on the morphology,microstructure,and properties of Cu-Zn alloy coatings were studied.[Result]The electrodeposition conditions were optimized as follows:current density 1.0 A/dm2,temperature 40℃,and time 20 min.The Cu-Zn alloy coating obtained under the optimized conditions was smooth and uniform with a single alloy phase,and 70.6%of Zn was removed after dealloying.[Conclusion]Porous copper foil with uniform size of pores can prepared by combination of electrodeposition and dealloying,but some cracks may appear,which needs further research and improvement.

porous copper foilcopper-zinc alloyelectrodepositiondealloyingmicrostructure

郭翡翔、杨斌、凌羽、宋克兴、卢伟伟、安茂忠、戎万、孙梁

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河南科技大学材料科学与工程学院,河南 洛阳 471023

河南省科学院材料研究所,河南 郑州 450052

哈尔滨工业大学化工与化学学院,黑龙江 哈尔滨 150038

西北有色金属研究院,陕西 西安 710016

华为技术有限公司,广东 深圳 518116

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多孔铜箔 铜-锌合金 电沉积 脱合金化 微观结构

国家重点研发计划河南省科技攻关计划

2021YFB3400800232102230050

2024

电镀与涂饰
广州市二轻工业科学技术研究所

电镀与涂饰

CSTPCD北大核心
影响因子:0.47
ISSN:1004-227X
年,卷(期):2024.43(6)
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