Etching behavior of rose gold target during magnetron sputtering
[Introduction]Magnetron sputtering of rose gold film has outstanding environmental advantages over electroplating.However,there are few research reports about etching behavior of target during magnetron sputtering.[Method]Magnetron sputtering was conducted with a planar target made of Au85 rose gold under vacuum condition.The effects of target current,power density,and magnetic field arrangement on the etching behavior of target were studied.[Result]The glow and sputtering process were stable at low target current and power density.The target particles were sputtered preferentially layer by layer along a crystal surface,forming stepped linear stripes.V-shaped grooves were formed on target surface,and the angle between the slope of etched area and the normal direction of target surface was about 75°-76°.With the increasing of target current or power density,arc discharge occurred occasionally during sputtering,and mastoid-like micromorphology was formed on the etched area.The target material melted in a short time when the target current was too high.The depth and width of etching grooves were nonuniform due to the endpoint effect caused by the magnetic field arrangement of target base.[Conclusion]In order to improve the utilization of planar precious metal target,the magnetic field layout should be modified,and the power density should be controlled lower than the threshold of arc discharge.
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