不同因素对OSP用于镀锡板时保护效果的影响
Factors affecting the protection effectiveness of OSP when applied to tinplate
周星辰 1宋键 1申熏 2万传云1
作者信息
- 1. 上海应用技术大学化学与环境工程学院,上海 201418
- 2. 无锡鼎亚电子材料有限公司,江苏 无锡 214000
- 折叠
摘要
[目的]以某市售有机可焊保护剂(OSP)为例,研究OSP在不同条件下对镀锡板的保护效果.[方法]通过中性盐雾试验、干/湿老化试验及可焊性测试,研究了镀锡板的基体材质、镍中间层的引入及其厚度、镀锡层的厚度及其种类对OSP保护效果的影响.[结果]当镀锡板采用锡铜合金为基材、1～2 μm厚的镍为中间层及2～3 μm厚的雾锡为外层时,OSP展现出最佳的保护效果.[结论]本文的研究结果可为企业选择镀锡板防护技术提供实验数据和指导.
Abstract
[Introduction]The protection effectiveness of organic solderability preservative(OSP)on tinplate under different conditions was studied with a commercially available OSP.[Method]The effects of substrate material,introduction of nickel intermediate layer with different thickness,and thickness of different kinds of tin coatings on the protection effectiveness of OSP were studied by neutral salt spray test,dry and wet aging tests,and solderability test.[Result]The OSP showed the best protection effectiveness on the tinplate using tin-copper alloy as substrate,nickel coating with a thickness of 1-2 μm as intermediate layer,and matte tin coating with a thickness of 2-3 μm as outer layer.[Conclusion]The results of this paper can provide experimental data and guidance for companies to select suitable protection technology of tinplate.
关键词
镀锡板/有机可焊保护剂/耐蚀性/可焊性/抗老化Key words
tinplate/organic solderability preservative/corrosion resistance/solderability/aging resistance引用本文复制引用
出版年
2024
NETL
NSTL
万方数据