附载体极薄铜箔中新型无机/有机复合剥离层的研究

Study on a novel inorganic/organic composite peeling layer of carrier-attached ultrathin copper foil

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中文摘要：[目的]剥离层是成功制备和应用附载体极薄铜箔的关键所在.针对目前单一无机或有机剥离层存在的问题,开展了无机-有机复合剥离层的研究,以期实现载体箔/剥离层/极薄铜箔的多界面剥离强度的差异化控制.[方法]首先电沉积制备了35 μm厚的铜箔为载体箔,然后依次电沉积Zn-Ni合金层和浸镀2-巯基苯并咪唑(2-MBI)有机层,构建了无机/有机复合剥离层,最后在复合剥离层上电沉积极薄铜箔,制备出附载体极薄铜箔.[结果]Zn-Ni合金层浸镀于 2-MBI中时,2-MBI分子可通过其N原子和S原子与Zn、Ni发生键合而锚定在合金层表面,进而构成Zn-Ni合金/2-MBI复合剥离层,令载体箔与极薄铜箔之间的剥离强度适中(约 0.083 N/mm),且两者剥离后极薄铜箔的光面无 Zn-Ni 合金残留.[结论]采用无机/有机复合剥离层可实现载体箔/剥离层/极薄铜箔多界面剥离强度的差异化控制,为成功制备附载体极薄铜箔奠定了基础.

外文摘要：[Introduction]The peeling layer is crucial for the successful fabrication and application of carrier-attached ultrathin copper foil.However,both single organic and inorganic peeling layers have their shortcomings.It is necessary to develop an inorganic-organic composite peeling layer to achieve the differential control of peel strength at multiple interfaces of carrier foil,peeling layer,and ultrathin copper foil.[Method]Firstly,a 35 μm-thick copper foil was prepared by electrodeposition as carrier.Secondly,an inorganic-organic composite peeling layer was fabricated by electrodeposition of Zn-Ni alloy layer and immersion in 2-mercaptobenzimidazole(2-MBI)successively.Finally,a carrier-attached ultrathin copper foil was obtained by electrodepositing an ultrathin copper foil onto the composite peeling layer.[Result]2-MBI molecules could be anchored onto the surface of Zn-Ni alloy layer through the bonding between N and S atoms with Zn and Ni,forming a Zn-Ni alloy/2-MBI composite peeling layer.The peel strength between the carrier foil and the ultrathin copper foil was moderate(about 0.083 N/mm)due to the presence of the composite peeling layer,and no Zn-Ni alloy layer would be left on the shiny side of the ultrathin copper foil after peeling.[Conclusion]The novel inorganic/organic composite peeling layer enables the differential control over the peel strengths of different interfaces in the carrier foil/peeling layer/ultrathin copper foil sandwich structure,laying the foundation for the successful fabrication of carrier-attached ultrathin copper foil.

外文关键词：

carrier-attached ultrathin copper foilzinc-nickel alloy2-mercaptobenzimidazolecomposite peeling layerpeel strength

作者：

张少强、卢伟伟、宋克兴、刘海涛、武玉英、杨祥魁、樊斌锋、王庆福

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作者单位：

河南科技大学化学化工学院,河南洛阳 471023

河南省有色金属材料科学与加工技术重点实验室,河南洛阳 471023

河南科技大学材料科学与工程学院,河南洛阳 471023

山东大学材料科学与工程学院,山东济南 250061

山东金宝电子有限公司,山东招远 265400

河南高精铜箔产业技术研究院有限公司,河南灵宝 472500

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关键词：

附载体极薄铜箔锌-镍合金 2-巯基苯并咪唑复合剥离层剥离强度

基金：

国家重点研发计划项目河南省科技研发计划联合基金重点项目河南省重点研发专项河南省中原学者工作站资助项目

项目编号：

2021YFB3400800225200810026231111241000224400510025

出版年：

2024

DOI：

10.19289/j.1004-227x.2024.10.007

电镀与涂饰

广州市二轻工业科学技术研究所

电镀与涂饰

CSTPCD北大核心

影响因子：0.47

ISSN：1004-227X

年,卷(期)：2024.43(10)