[Introduction]The hydrogen peroxide-sulfuric acid solution used for micro-etching of PCB(printed circuit board)faces some issues such as easy decomposition of hydrogen peroxide and excessively high etching rates.It is greatly significant to develop suitable corresponding stabilizers.[Method]The copper foil was micro-etched in a solution composed of hydrogen peroxide,sulfuric acid,and copper ions.The basic composition of etching solution was determined by studying the effects of temperature and mass concentration of each component on the etching rate.A series of compound stabilizers with different contents were designed to obtain the suitable micro-etching solutions for different requirements.[Result]The basic composition of micro-etching solution and process conditions were optimized as follows:concentrated sulfuric acid 140 g/L,hydrogen peroxide 110 g/L,copper ion 25 g/L,temperature 30℃,and time 1 min.A composite stabilizer with tetrahydroxypropyl ethylenediamine(EDTP)and disodium ethylene-diaminetetraacetate(EDTA-2Na)as the primary components,and an appropriate addition of one or more auxiliary components i.e.ammonium dihydrogen phosphate(DAP),N-methyldiethanolamine(DMEA),2-amino-2-methyl-1-propanol(AMP),triethanolamine(TEA),2-methylimidazole(2-MI),and 1,6-hexanediol(HDO)can be selected.[Conclusion]The micro-etching process of copper foil obtained in this paper has the advantages of controllable etching rate,surface roughness,and surface morphology,meeting various production requirements.
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