Review of Fault Analysis and Diagnosis Methods for Modular Multilevel Converter Submodules
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NETL
NSTL
维普
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随着模块化多电平换流器(Modular Multilevel Converter,MMC)的广泛应用,其内部存在的问题也日益突出并成为制约系统稳定运行的主要因素.MMC子模块拓扑结构分为半 H 桥型、全 H 桥型和双箝位型 3 种,其中最典型的是半 H 桥型子模块,其内部由 2 个IGBT以及与其反并联的二极管和 1 个电容组成.在运行平稳的电路中,若子模块内部二极管、IGBT、储能电容任一发生故障,都可能会引起系统内部电路结构的变化,致使系统无法稳定运行,甚至直接崩溃.因此,对子模块内部故障的研究很有意义.针对 IGBT、二极管和电容在子模块中的故障情况以及故障诊断与定位的方法进行了详细的介绍与分析.
With the wide application of modular multilevel converter(MMC),its internal problems have become increas-ingly prominent and the main factor restricting stable operation of the system.The topology of MMC submodule is divided into three types:half H bridge,full H bridge and double clamped type.The most typical one is half bridge submodule,which is composed of two IGBTs,diodes in parallel with them and a capacitor.In a circuit that runs smoothly,if any of di-odes,IGBTs and energy storage capacitors in the submodule encounters a fault,the structure of the circuit inside the sys-tem may change and the system cannot run stably,or even collapse directly.Therefore,it is very meaningful to study the internal fault of submodule.In this paper,the fault situation of IGBT,diode and capacitor in submodule and the method of fault diagnosis and location are introduced and analyzed in detail.
modular multilevel converter(MMC)submodulefault analysisfault diagnosis and location