首页|CuNi30材料在真空灭弧室上的应用研究

CuNi30材料在真空灭弧室上的应用研究

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对CuNi30 材料在真空灭弧室上的应用可行性进行了研究.分析了 CuNi30、无氧铜、不锈钢材料的理化性能、表面清洗性能、钎料流散浸润性能、封接抗拉性能,并进行整管装配试验.试验结果表明,CuNi30 材料的抗拉强度介于不锈钢和无氧铜之间,且其抗拉强度和延伸率在高温处理前后变化不大,而硬度略有下降.在通用钎焊规范下,CuNi30 材料可直接与金属化瓷壳进行封接,其封接强度优于不锈钢与无氧铜过渡结构.装配的灭弧室经 A组试验(振动试验、交变湿热试验)以及盐雾试验证明其可以满足真空灭弧室的使用需要.
Applicative Study of CuNi30 Material in Vacuum Interrupter
In this paper,the application feasibility of CuNi30 material in vacuum interrupter is studied.The physical and chemical properties,surface cleaning properties,flow wetting properties of brazing metal,sealing tensile properties and whole tube assembly of CuNi30,oxygen-free copper and stainless steel were tested.The results show that the tensile strength of CuNi30 is between that of stainless steel and oxygen-free copper,and the tensile strength and elongation of CuNi30 have little change before and after high temperature treatment,while the hardness decreases slightly.Under the general brazing standard,the CuNi30 material can be directly sealed with the metallized porcelain shell,and its sealing strength is better than that of the oxygen-free copper transition structure used in stainless steel.Group A tests(vibration test,alternating damp heat test and salt spray test show that the assembled interrupter can meet the needs of the vacuum interrupter.

CuNi30vacuum interruptercover platebrazing

张宝林、杨振生、李向东

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陕西宝光真空电器股份有限公司,陕西 宝鸡 721000

CuNi30 真空灭弧室 盖板 钎焊

2024

电工技术
重庆西南信息有限公司(原科技部西南信息中心)

电工技术

影响因子:0.177
ISSN:1002-1388
年,卷(期):2024.(17)