首页|多物理场耦合下单芯电缆中间接头压接缺陷及温度分布仿真分析

多物理场耦合下单芯电缆中间接头压接缺陷及温度分布仿真分析

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为研究接触电阻引起的压接缺陷对电缆中间接头温度分布的影响,使用有限元软件COMSOL建立了 110 kV电缆中间接头的多物理场耦合三维仿真模型,并基于等效电导率建立接触电阻等效模型.分析了环境温度、负荷电流以及压接缺陷严重程度对电缆接头温度的影响并进行多元函数拟合,得到电缆中间接头线芯温度与各因素的定量关系式,为存在压接缺陷时的电缆中间接头线芯温度计算提供理论方案.
Simulation Analysis of Crimping Defects and Temperature Distribution of Multi-physics Coupling Single-core Cable Joints
In order to study the effect of contact resistance-induced crimping defects on temperature distribution of cable joints,three-dimensional multi-physics coupling simulation on the joint of a 110 kV cable was carried out using the finite element software COMSOL,and the equivalent contact resistance model was established based on the equivalent conduc-tivity.The influences of ambient temperature,load current,and crimping defect severity on the temperature of the cable joint were analyzed,and the quantitative relationships between the joint core temperature and each aforementioned factor were obtained by multivariate function fitting.The simulation was expected to provide useful information for joint core temperature calculation of cables encountering crimping defects.

cable jointcrimping defectfinite element simulationmultiple physical fieldsfunction fitting

鲁浩然

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安徽理工大学电气与信息工程学院,安徽淮南 232001

电缆中间接头 压接缺陷 有限元仿真 多物理场 函数拟合

2024

电工技术
重庆西南信息有限公司(原科技部西南信息中心)

电工技术

影响因子:0.177
ISSN:1002-1388
年,卷(期):2024.(22)