On-Line Condition Monitoring of IGBT Module Based on Parameter Inversion of Spatial Multi-Point Temperature
As the core component of high voltage and high power energy conversion systems,the insulated gate bipolar transistor(IGBT)has been widely used in new energy power generation,high-speed railways,aerospace,and other fields.Due to the complex and various working environments and operation conditions,large temperature fluctuations arise during the operation of the IGBT module.Considering that the thermal expansion coefficient of each layer for the module is different,thermal mechanical stress is generated between each layer.Continuous temperature fluctuation produces cyclic thermal stress,resulting in thermal damage to materials in each layer.When the accumulation of thermal damage exceeds the safety threshold,the IGBT module will suddenly fail and eventually cause the shutdown of the energy conversion system.According to the reliability research report of power electronic systems,about 34%of energy conversion system failures are attributed to the failure of power devices such as IGBTs.Therefore,from the reliability perspective,online health condition monitoring of the IGBT module has become a significant guarantee of improving the operational reliability of the energy conversion system.This paper proposes an online health monitoring method based on parameter inversion of spatial multi-point temperature to realize thermal damage diagnosis for IGBT's bond wires and solder layer.This method can avoid the sudden failure of the IGBT module due to the accumulation of thermal damage exceeding the safety threshold,improving the reliable performance of the energy conversion system.Firstly,considering the influence of solder layer aging on the heat flow path inside the module,the temperature distribution of multiple points on the baseplate is changed.The selected multi-point baseplate temperature is collected by placing a temperature sensor between the baseplate and the heatsink.An online monitoring model of solder aging is establishedbased on the multi-point temperature difference of baseplate(∇TP).The databases of ∇T P and chip-to-substrate thermal impedance(ZJC)are established by an offline accelerated aging test method.In the application,ZJC is called by ∇T P to realize an online diagnosis of solder layer health status.Secondly,the calculation model of conduction power loss in hybrid aging mode is established.Accordingly,the inverse calculation algorithm of on-state collector-emitter voltage Vce-on based on conduction power loss is proposed.The chip junction temperature TJ is calculated based on the updated ZJC value,and the collector current IC and TJ are given into the IC-TJ-Vce-on database of the healthy IGBT module to invoke Vce-on,data at the current junction temperature.The influence of junction temperature rise caused by solder aging on Vce-on is eliminated,and the aging state of bond wires is diagnosed based on the deviation of Vce-on and Vce-on,data.Simulation and experimental results show the effectiveness of the proposed method,and the diagnostic error is about 3%under experimental conditions.
国家科技期刊平台
NSTL
万方数据
