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200 V全碳化硅集成技术

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本文提出了一种基于N衬底P外延晶圆的全碳化硅(Silicon Carbide,SiC)集成工艺平台,该工艺平台兼容低压互补金属氧化物半导体场效应晶体管(Complementary Metal Oxide Semiconductor field-effect transistor,CMOS)、横向扩散金属氧化物半导体(Laterally-Diffused MOS,LDMOS)以及高压二极管等器件.采用P型缓冲层技术调节器件垂直方向电场分布,使高压器件垂直方向耐受电压提高212.4%;在1µm厚度的P型缓冲层和1µm厚度的P型外延层上,实现LDMOS、高压二级管和高侧区域耐受电压大于300 V.基于该工艺平台,搭建了SiC CMOS反相器和反相器链电路,均实现了0~20 V轨至轨的电压输出;设计了半桥驱动电路,低压侧驱动电路由四阶反相器构成;高压侧驱动电路由电平移位电路和高侧区域反相器链电路组成,实现了180~200 V浮空栅极驱动信号输出.
200 V All-SiC Integration Technology
An all silicon carbide integrated process platform based on the wafer with N-substrate and P-epitaxy is pro-posed in this paper,which is compatible with CMOS (Complementary Metal Oxide Semiconductor field-effect transistor) devices,LDMOS (Laterally-Diffused MOS) and high-voltage diodes. A P-buffer layer is adopted to modulate the vertically distributed electric field and potential,which results in 212.4% improvement in vertical voltage withstanding. The LDMOS,high voltage diode and high side region can achieve more than 300 V breakdown voltage in 2 µm P-type epitaxial layer. Based on this platform,SiC (Silicon Carbide) CMOS inverter and inverter chain are constructed,all of which achieve volt-age output ranging from 0~20 V with rail-to-rail capability. A half-bridge driving circuit is designed with a four-stage invert-er chain as the low-side driver circuit. The high-side driver circuit consists of level-shifting circuit and a high-side region in-verter chain circuit,producing an output of 180~200 V floating gate drive signal.

silicon carbide (SiC)integrationsilicon carbide integrated circuitSiC inverterSiC laterally-diffused metal Oxide semiconductor

顾勇、马杰、刘奥、黄润华、刘斯扬、柏松、张龙、孙伟锋

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东南大学集成电路学院,江苏南京 210096

南京电子器件研究所,江苏南京 210016

碳化硅(SiC) 集成 碳化硅集成电路 碳化硅反相器 碳化硅横向扩散金属氧化物半导体

国家自然科学基金国家自然科学基金江苏省科技成果转化专项资金项目

6227403262174029BA2022005

2024

电子学报
中国电子学会

电子学报

CSTPCD北大核心
影响因子:1.237
ISSN:0372-2112
年,卷(期):2024.52(7)