Field-circuit coupling simulation methods can achieve multi-level collaborative analysis across chips,pack-ages,and systems.Multi-physics simulation methods can be used to design the signal integrity,power integrity,and reliabil-ity of chip packaging under multiple physical constraints.The combination of field-circuit coupling simulation and multi-physics simulation has become a crucial direction for advanced packaging simulation technology.By utilizing these two types of simulations together,early-stage optimization of chip packaging designs can be achieved.This article discusses the current research status of field-circuit coupling simulation and multi-physics coupling simulation.The article also proposes a frequency-domain method for non-linear field-circuit co-simulation and an electromagnetic-thermal coupling simulation method.The frequency-domain method avoids the long iterative process of field-circuit coupling simulation based on time-domain methods,solving the multi-physics electromagnetic-thermal coupling analysis problem of non-linear field-circuit un-der multi-physics constraints.The calculation results verify the accuracy and efficiency of the proposed method.
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