Design of Embedded Microchannels for Ceramic Packaging Substrate Considering Wiring and Though Hole
As the heat flux of the chip continues to increase,the heat dissipation of package is a new challenge.Liq-uid cooling micro-channel heat dissipation technology is an important research direction to solve the problem of packaging thermal management.In this paper,microchannels embedded in ceramic substrate is proposed to solve the heat dissipation requirement of high power chip.This structure can shorten the distance between chip and heat sink,and reduce thermal re-sistance.It can also reduce the volume of the thermal control system,and realize the thermal control,electrical interconnec-tion and the integration of the structure.The design of embedded microchannels structure needs to consider the dense wiring and though hole in the ceramic substrate to avoid the interference between them.An embedded microchannels structure con-sidering wiring and though hole is designed,and an integrated processing method of micro-channel-wiring-via is proposed in this paper.The test results show that the location of embedded microchannels is more important than the structural param-eters.The convergence layer and the heat dissipation layer of the main channel of the embedded microchannels should be designed in the same layer.This embedded microchannels for ceramic packaging substrate can meet the heat dissipation re-quirement of the 100 W chip.
万方数据
维普
