首页|220 GHz Multi Circuit Integrated Front End Based on Solid-State Circuits for High Speed Communication System

220 GHz Multi Circuit Integrated Front End Based on Solid-State Circuits for High Speed Communication System

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This paper presents the research on a 220 GHz multi circuit inte-grated front end based on solid-state circuits.This integrated front end integrates a 220 GHz subharmonic mixer,a 110 GHz tripler,a 110 GHz 8 dB hybrid coupler and a 220 GHz waveguide bandpass fil-ter(BPF)in one single block.Compared to the tradition-al transceivers which usually use cascade connection of the independent mixers and multipliers,the size of the proposed multi circuit integrated front-end block is 25 mm×20 mm×20 mm,ten times smaller than the cas-cading transceiver.In order to check the tripler's output power,a modified compact 110 GHz 8 dB hybrid coupler is set between mixer and tripler.Due to the characterist-ics of the hybrid coupler,the deterioration of cascading transceiver's performance caused by mismatch has also been improved.In addition,to achieve single sideband(SSB)communication,a 220 GHz BPF with high selectiv-ity is integrated in the circuit.The measured conversion loss of the fabricated multi circuit integrated front end is less than 11 dB,where the LO and RF frequency are 37 and 210-220 GHz.Based on this front-end,a 220 GHz high speed communication system has been setup and it can achieve 10 Gbps data transmission using 16QAM modulation.

THz solid state circuitsLow connec-tion lossMulti circuit integrated front endMiniaturiza-tionSingle sideband communication

NIU Zhongqian、ZHANG Bo、DAI Bingli、ZHANG Jicong、SHEN Fang、HU Yi、FAN Yong、ZHANG Yihan

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School of Electronic Science and Engineering,University of Electronic Science and Technology of China,Chengdu 610054,China

Chongqing Institute of Microelectronics Industry Technology,University of Electronic Science and Technology of China,Chongqing 401332,China

国家自然科学基金国家自然科学基金国家自然科学基金National Key Research and Development Program of China中国博士后科学基金

6177111662022022621011072018YFB18015022021TQ0057

2022

10.1049/cje.2021.00.295

电子学报(英文)

电子学报(英文)

CSTPCDSCIEI
ISSN：1022-4653
年,卷(期)：2022.31(3)
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