Study on Static Deflection Model of MEMS Capacitive Microwave Power Sensors

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外文摘要：In this paper,a static deflection model of MEMS cantilever beam is proposed,which can better study the force deformation of micro-electro-mechanical system(MEMS)cantilever beam and the output characteristics of capacitive microwave power sensor.The deflection curve is used to describe the deformation of the cantilever beam and then the overload power and sensitivity of this power sensor are derived.It is found that the overload power de-creases with the beam length,and increases with the initial height of beam.The sensitivity increases with the beam length,and has a linear growth relationship with the measuring electrode width.A MEMS dual-channel microwave power sensor is designed,fabricated and measured.At a microwave signal frequency of 10 GHz,the sensitivity of the sensor is measured to be 0.11 V/W for the thermoelectric detection channel and 65.17 fF/W for the capacitive detec-tion channel.The sensitivity calculated by the lumped model is 92.93 fF/W,that by the pivot model is 50.88 fF/W,and that by the deflection model proposed in this work is 75.21 fF/W.Therefore,the theoretical result of the static deflection model is more consistent with the measured result and has better accuracy than the traditional lumped model and pivot model.

外文关键词：

Micro-electro-mechanical system(MEMS)cantilever beamStatic deflection modelPower sensorOverload powerSensitivity

作者：

Ye JIN、Debo WANG

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作者单位：

College of Electronic and Optical Engineering&College of Flexible Electronics(Future Technology),Nanjing University of Posts and Telecommunications,Nanjing 210023,China

College of Integrated Circuit Science and Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,China

基金：

National Natural Science Foundation of ChinaProvince Natural Science Foundation of JiangsuChina Postdoctoral Science FoundationStudent's Platform for Innovation and Entrepreneurship Training Program

项目编号：

61904089BK201907312017M621692202210293012Z

出版年：

2024

DOI：

10.23919/cje.2023.00.087

电子学报(英文)

CSTPCDEI

ISSN：1022-4653

年,卷(期)：2024.33(5)