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高复杂度PCBA装联工艺研究及应用

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本文通过研究工业级高复杂度PCBA器件特性,论述器件焊接工艺原理,识别出针对工业级器件的设计要点.涵盖BGA、0402Chip料、大热熔量插件物料等方面,围绕可制造性PCB设计、工艺制程参数两个角度进行分析验证.通过研究结果表明,工业级高端PCBA控制器通过工艺技术手段控制,可以实现良好的可制造性,为控制器生产厂商提供指导意义.
Research and Application of High Complexity PCBA Assembly Process
Starting from the characteristics of industrial grade devices,the principle of device welding process is dis-cussed,and the design points for industrial grade devices are analyzed.From the perspectives of device characteristics such as BGA,0402Chip material,and high hot melt plugins,analysis and verification are conducted from the perspec-tives of manufacturability PCB design and process parameters.The research results indicate that industrial High com-plexity PCBA controllers can achieve good manufacturability through process technology control,providing guidance for controller manufacturers.

BGAhigh melting capacity plug-inHIPwelding processmanufacturability

赵中、黄玉平

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广东威灵电机制造有限公司 佛山 528300

BGA 大热熔量插件 HIP 焊接工艺高复杂度PCBA装联工艺研究及应用 可制造性

2024

日用电器
中国电器科学研究院有限公司

日用电器

影响因子:0.071
ISSN:1673-6079
年,卷(期):2024.(12)