Application Research of QFN Solder Void Mechanism and Solution
The application of PCB design in QFN package voids is studied and verified.At the same time,the research on matching process technology factors is carried out.According to the QFN voiding defect mechanism,the improvement scheme of QFN voids is proposed and verified.Through the comparison of experimental data,the impact of PCB design and process was evaluated and confirmed,providing design and process solutions to solve the problem of QFN voids in the industry.
万方数据
维普
