钛合金表面椭圆微坑阵列模板电解加工试验研究
Experimental Investigation on Through-mask Electrochemical Machining of Elliptical Micro-dimple Arrays on Titanium Alloy
严政 1王天明 2李寒松 1房晓龙1
作者信息
- 1. 南京航空航天大学机电学院,江苏南京 210016
- 2. 北京卫星制造厂有限公司,北京 100094
- 折叠
摘要
针对离子推进器织构化流道高效精密加工需求,开展TC4 钛合金表面椭圆形微坑阵列模板电解加工试验研究.通过电场有限元仿真,发现随着加工进行,微坑逐渐由矩形变为椭圆并最终变为近似圆形,而且微坑在椭圆短轴方向上增量要大于长轴方向.通过设计一种辅助支撑压紧装置以抑制非加工表面杂散腐蚀,研究了加工时间、占空比对微坑尺寸的影响.研究表明,在加工电压 30 V、频率 2 kHz、时间 60 s、占空比 8%的优选参数下,可以实现椭圆形微坑阵列的高效高一致性加工,得到的平均深度为 98.04 μm,长轴和短轴平均宽度分别为198.25 μm和 186.84 μm.
Abstract
In order to meet the manufacture demands of textured flow channels in ion thruster,experimental research on through-mask electrochemical machining(TMECM)of elliptical micro-dimple arrays on titanium alloy TC4 was carried out.Through simulations on electric field,it was found that as machining goes on,the micro-dimple gradually changes from rectangular to elliptical and eventually to approximately circular,and the increment of micro-dimple in the short axis direction of the ellipse is greater than that in the long axis direction.An auxiliary support compression device was designed to inhibit the stray corrosion of the non-machined surface,and the influence of machining time and duty cycle on the dimple size was studied.The study showed that under the optimal conditions of processing voltage of 30 V,frequency of 2 kHz,time of 60 s and duty cycle of 8%,the elliptical micro-dimple arrays were efficiently and consistently processed with an average depth of 98.04 μm,and the average long axis width and short axis width is 198.25 μm and 186.84 μm.
关键词
模板电解加工/钛合金/阵列结构/椭圆形微坑/杂散腐蚀Key words
through-mask electrochemical machining/titanium alloy/array structure/elliptical micro-dimple/stray corrosion引用本文复制引用
基金项目
江苏省自然科学基金项目(BK20222010)
出版年
2024
NETL
NSTL
万方数据