Basic Research on Supply of Working Fluid for Electroplated Diamond Wire Cutting Based on Ultrasonic Capillary Effect
Lamination and fineness are conducive to the photovoltaic industry to reduce cost and increase efficiency,and reduce the cost of electricity generation,which is an important development trend of solar silicon cutting.The fine line cutting results in the reduction of the distance between the silicon wafer to about 100 μm,and the lamination results in the further reduction of the bending resistance of the silicon wafer,so the silicon wafer adsorption and bonding phenomenon is extremely easy to occur between the silicon wafer,thereby increasing the risk of silicon wafer rupture.In this paper,the capillary effect induced by ultrasound is used in electroplated diamond wire silicon wafer cutting to reduce the inhibition of wafer adsorption.In order to explore the law of ultrasonic capillary action between plates and guide the industrial application,the influences of parallel plate spacing,plate and ultrasonic sink bottom spacing,plate non-parallelism,working liquid temperature,ultrasonic action time on ultrasonic capillary phenomenon were studied.The research results provide guidance for industrial application,which is helpful to inhibit wafer adsorption,reduce wafer bending,reduce surface crack damage and improve fracture strength of thin wire cut silicon wafers.
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