The heat dissipation problem of internal equipment in electronic pods has always been one of the key issues in pod design.This calculation states are selected under different altitude and speed states based on flight envelope.The grid model is established by simplifying the pod and cooling system.The internal ventilation duct and external aerodynamic characteristics of the pod under different states are calculated and analyzed and the corresponding flow field data are obtained.The flow field data are imported into the thermodynamic calculation model to obtain the temperature field of the chip mounting plate inside the pod under different states.And then the thermal dissipation performance inside the pod is analyzed.The results show that the cool-ing effect of the pod during high-altitude fight is better than that during low-altitude fight.And compared to high-speed flight,low-speed flight has better heat dissipation effect.The temperature difference between the chip mounting plates in ventilation duct is not significant,with a maximum temperature of 321 K,which meets the heat dissipation requirements of internal elec-tronic equipment.
electronic podenvironmental control systemaerodynamic characteristicsthermodynamicstemperature field
万方数据
维普
