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真空电弧多物理场仿真与微观流场动态观测

Multi Physical Field Simulation of Vacuum Arc and Dynamic Observation of Micro Flow Field

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通过建立考虑铜蒸气物性的真空电弧自生多物理场耦合模型,将仿真模拟与试验研究相结合,对真空断路器中电弧特性的行为规律进行定性和定量研究.利用COMSOL Multiphysics仿真分析电弧燃烧过程中温度、压力、速度、电流密度、磁场强度等关键参量及多物理场耦合作用机理.研究结果表明:等离子体温度、压力、电流密度等参数呈倒锥状分布,阴极表面温度始终高于阳极表面温度,阳极表面电流密度分布直径明显大于阴极表面电流密度分布直径;等离子体轴向速度呈纺锤形分布,径向速度呈正梯形分布,存在较大轴向和径向速度梯度;磁场强度呈环状分布.结合微观流场动态观测试验,仿真结果与电弧照片具有良好的一致性,与传统磁流体仿真模型相比,试验模型电弧形态自生,轮廓细节特征呈现丰富.
A multi-physics field coupling model is established to optimize vacuum circuit breakers,consider-ing the physical properties of copper vapor in a vacuum arc.The behavior of arc characteristics in vacuum cir-cuit breakers is qualitatively and quantitatively studied by combining simulation and experiment research.COMSOL multi-physics simulation is used to analyze key parameters such as temperature,pressure,velocity,current density,magnetic field strength and the mechanism of multi-physics field coupling during the arc com-bustion process.The results show that the parameters such as plasma temperature,pressure and current densi-ty are distributed in an inverted cone shape.The cathode surface temperature is always higher than the anode surface temperature,and the diameter of the anode surface current density distribution is significantly larger than that of the cathode surface current density distribution.The axial velocity of plasma follows a spindle-shaped distribution,while the radial velocity follows a normal trapezoidal distribution with significant axial and radial velocity gradients.The magnetic field intensity is distributed in a circular pattern.After Combination with the dynamic observation experiment of the microflow field,the simulation results are consistent with the arc photos.Compared with the traditional magnetic fluid simulation model,this model has a self-generated arc shape and rich contour details.

vacuum arcmultiple physical fieldsdynamic flow fieldobservationcoupling

赵一鉴、李金金、库照宇、张传龙、董华军

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大连交通大学 机械工程学院,辽宁 大连 116028

大连理工大学 电气工程学院,辽宁 大连 116024

真空电弧 多物理场 动态流场 观测 耦合

2024

大连交通大学学报
大连交通大学

大连交通大学学报

CSTPCD
影响因子:0.258
ISSN:1673-9590
年,卷(期):2024.45(6)