Design of Heat Sinks for Power Electronic Devices Using Liquid Metals
The vast majority of IGBT module converter valves use water-cooled systems.The heat dissipation technology of water cooling systems is mature and has many advantages,but with the increase of the heat dissipa-tion power of power electronic devices,traditional water cooling systems will gradually be unable to meet the heat dissipation needs of power electronic devices.Based on the existing traditional water-cooled heat dissipation sys-tem model,numerical simulation analysis techniques were used to compare and analyze the heat dissipation perfor-mance of the heat dissipation system using different cold plate materials(copper,aluminum)and cooling working fluids(water,liquid metal)under different working conditions.The heat dissipation working fluids were replaced with deionized water and liquid metal,respectively.The comparative analysis showed that the heat dissipation per-formance of the heat dissipation system using copper and liquid metal was greatly improved.On this basis,a liq-uid metal heat dissipation system model was proposed,and its high superiority in heat dissipation performance was demonstrated through comparison with traditional cooling models.
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