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射频电路封装设计与工艺实现方法研究

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通信技术与社会发展息息相关,射频电路推动了通信技术的硬件水平,并已成为射频系统研究的热点之一.射频电路与数字电路的区别在封装技术方面也有区别,本文以封装设计和工艺实现方法为研究对象,从射频电路基本原理、封装设计方法和工艺实现三个方面展开,介绍了射频电路封装的发展现状、技术需求和工艺路线,对射频电路的封装具有一定的指导意义.
Research on design and process of electrical packaging for RF circuit
Communication technology is closely related to social development.The realization of RF circuit had promoted the level of communication technology,and had become one of the hot spots of RF circuit.The difference between RF circuit and digital circuit re-flected in the packaging technology.This paper took packaging design and process as the title,and introduced the development status,technical requirements and process route of RF circuit.Electrical packaging consisted of basic principle,packaging design and implemen-tation,which had guiding significance for RF circuit packaging.

wireless communicationRF circuitelectrical packagingbonding process

苏德志、王岑、詹兴龙

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山东航天电子技术研究所,烟台 264000

无线通信 射频电路 封装工艺 键合工艺

2025

单片机与嵌入式系统应用
北京航空航天大学

单片机与嵌入式系统应用

影响因子:0.306
ISSN:1009-623X
年,卷(期):2025.25(1)