Numerical simulation and optimization of chip water-cooled heat sink
In order to solve the high heat flux density and energy consumption problems faced by data center servers,a comparison was conducted among three channel structures for chip cool-ing,including horizontal parallel long channels,vertical parallel long channels and a cross-channel configuration with both horizontal and vertical access.The study aimed to identify the optimal channel structure and fin pitch,numerical simulations were performed on server rack chip assem-blies to determine the minimum flow rate required to maintain the safe operation of chip assemblies(70 ℃)as a function of the inlet water temperature.The results indicates that the horizontal par-allel long channel structure offers the best overall cooling performance,enhancing the comprehen-sive heat transfer factor by 41.4％.With a fin pitch of 0.3 mm in the horizontal parallel long channel structure,the chip cooling is most effective.To maintain safe operation of the chip assem-bly,when the inlet temperature is below 10 ℃,the demand for flow rate is minimal,only 62.5 g/s.However,as the inlet temperature exceeded 30 ℃,the demand for flow rate increases signifi-cantly,with a growth rate of up to 44.2％.The study also provides a fitted formula between inlet temperature and minimum flow rate.
data centerwater-cooled heat sinknumerical simulationchannel structure opti-mization
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