Heat transfer characteristics of chip heat sink based on micro heat pipe array
To ensure that the operating temperature of the chip is within a safe range,this study designed a heat dissipation device for chip thermal management using a micro heat pipe array(MHPA).The effects of different evaporation end lengths and liquid filling rates on the heat transfer performance of single L-MHPA and U-MHPA heat sinks were experimentally tested,and the heat transfer performance of dual L-MHPA and U-MHPA chip heat sinks with different inclination angles was compared.The results show that both excessively high liquid filling rate and excessively long evaporation end length reduce the heat transfer capacity of MHPA heat sink;The U,-MHPA chip heat sink when placed horizontally has the best heat transfer performance.At a heating power of 160 W,the average thermal resistance of the heat sink is 89.6 K/(W·m2),and the heat sink can stabilize the temperature of the chip at 57.9 ℃.The dual L-MHPA chip heat sink has better tilt angle adaptability.
ChipMicro heat pipe arrayHeat transfer performanceThermal resistance
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