基于微热管阵列芯片散热器的传热特性
Heat transfer characteristics of chip heat sink based on micro heat pipe array
陈晔 1王宏燕 1赵耀华 2田济邦 1全贞花1
作者信息
- 1. 北京工业大学绿色建筑环境与节能技术北京市重点实验室,北京 100124
- 2. 北京工业大学绿色建筑环境与节能技术北京市重点实验室,北京 100124;淄博博一新能源科技发展有限公司,淄博 255200
- 折叠
摘要
为保证芯片的工作温度在安全范围内,研究利用微热管阵列(MHPA)设计了用于芯片热管理的散热装置.通过实验测试了不同蒸发端长度和充液率对单L型和U型MHPA散热器传热性能的影响,并对双L-MHPA和U-MHPA芯片散热器进行不同倾角的传热性能对比实验.结果表明:过高的充液率和过长的蒸发端长度均降低了 MHPA散热器的传热能力,水平放置时的U1-MHPA芯片散热器具有最佳的传热性能,在160 W的加热功率下,散热器平均热阻为89.6 K/(W·m2),散热器能稳定芯片的温度在57.9℃.双L型散热器具有更好的倾角适应能力.
Abstract
To ensure that the operating temperature of the chip is within a safe range,this study designed a heat dissipation device for chip thermal management using a micro heat pipe array(MHPA).The effects of different evaporation end lengths and liquid filling rates on the heat transfer performance of single L-MHPA and U-MHPA heat sinks were experimentally tested,and the heat transfer performance of dual L-MHPA and U-MHPA chip heat sinks with different inclination angles was compared.The results show that both excessively high liquid filling rate and excessively long evaporation end length reduce the heat transfer capacity of MHPA heat sink;The U,-MHPA chip heat sink when placed horizontally has the best heat transfer performance.At a heating power of 160 W,the average thermal resistance of the heat sink is 89.6 K/(W·m2),and the heat sink can stabilize the temperature of the chip at 57.9 ℃.The dual L-MHPA chip heat sink has better tilt angle adaptability.
关键词
芯片/微热管阵列/传热性能/热阻Key words
Chip/Micro heat pipe array/Heat transfer performance/Thermal resistance引用本文复制引用
基金项目
国家重点研发项目(2022YFE0118500)
出版年
2024
NETL
NSTL
万方数据