Performance analysis and evaluation of Thermoelectric Cooler for electronic chips
In order to explore the heat dissipation effect of Thermoelectric Cooler on electronic chips and its own perform-ance,this paper established a TEC air-cooled heat dissipation model for finite element analysis.Through the research and anal-ysis of key parameters such as heat source surface temperature,temperature difference between hot and cold end of TEC and cool-ing rate,the change law of current was obtained,which including heat source surface temperature and external heat dissipation conditions on TEC heat dissipation performance,the effective working conditions and application range of TEC under different conditions were evaluated by finite element analysis.The results show that there is an optimal current under certain ambient tem-perature and heat dissipation conditions,which makes the application range of TEC the largest,and the application range expands with the increase of ambient temperature.
Thermoelectric CoolersFinite element analysisEffective working conditions
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