首页|Bi-2212低电阻接头制备与低温实验测试

Bi-2212低电阻接头制备与低温实验测试

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低电阻接头的制备及应用有利于提升超导磁体的稳定性及磁场质量,本文利用高温银线烧结法制备了Bi-2212低电阻接头,利用低温材料测试平台对Bi-2212不同压缩扁样的临界电流和高温银线烧结接头进行测试,并分析磁场强度、接触长度、搭接面积等关键因子对接头电阻的影响.实验结果表明:采用新型接头制备工艺研制的Bi-2212接头,当长度达到30 mm,搭接面积达到32.7 mm2时,在4.2 K、5 T背场环境下接头电阻可降至4.5×10-8 Ω,并趋于稳定,且磁场对其影响可忽略不计.
Preparation and low-temperature experimental testing of low-resistance joints in Bi-2212
The preparation and application of low-resistance joints are beneficial for enhancing the stability and magnetic field quality of superconducting magnets.Bi-2212 low-resistance joints were prepared using the high-temperature silver wire sintering method.Low-temperature experimental testing was conducted to measure the critical current of different compressed flat Bi-2212 samples and the high-temperature silver wire sintered joints.The effects of key factors such as magnetic field strength,contact length,and overlap area on joint resistance were analyzed.Experimental results indicate that Bi-2212 joints prepared using the novel joint preparation technique can achieve a resistance of 4.5 × 10-8 Ω when the length reaches 30 mm and the overlap area reaches 32.7 mm2 under a 4.2 K,5 T background magnetic field environment,and tend to stabilize,with negli-gible influence from the magnetic field.

Bi-2212Low-resistance jointsHigh-temperature silver wire sintering method

朱华锦、周孟良、万佳昊、杨东昇、秦经刚、周超、汪键、高鹏

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安徽理工大学机械工程学院,淮南 232001

合肥综合性国家科学中心能源研究院,合肥 230001

中国科学院等离子体物理研究所,合肥 230031

Bi-2212 低电阻接头 高温银线烧结法

国家自然科学基金

52207035

2024

低温与超导
中国电子科技集团公司第十六研究所

低温与超导

北大核心
影响因子:0.243
ISSN:1001-7100
年,卷(期):2024.52(3)
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