Fabrication of silicon-based microchannel heat sink and study on its heat transfer performance
To solve the heat dissipation problem of GaN chips with heat flux density 350 W/cm2 in RF components,a silicon-based microchannel heat sink with segmented straight channel was designed and fabricated.The flow and heat transfer charac-teristics of heat sinks with three types of coolants,different channel widths and depths were studied by numerical simulation.Suitable coolant was selected,and the channel size of the heat sink was optimized.The results show that 65# antifreeze is the most suitable coolant for cooling high-power RF components.The width of the channel affects both the heat transfer performance and flow resistance of the heat sink,while the depth of the channel only affects the flow resistance of the heat sink and has almost no effect on its heat transfer performance.The decoupling design of the heat sink can be achieved by optimizing the width of the channel to adjust the heat transfer performance,and by optimizing the depth of the channel to adjust the flow resistance.The op-timized heat sink with channel width of 50 μm and channel depth of 500 μm can meet the heat dissipation needs of RF compo-nents,while the case temperature of chip is less than 85 ℃,and the pressure difference between inlet and outlet is less than 100 kPa.
MicrochannelHeat sinkHeat transfer performanceFabrication ProcessingNumerical simulation
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