Numerical simulation of liquid cooling performance of high power electronic devices
In order to further enhance the heat transfer performance of the liquid cooling plate,a small liquid cooling plate for high-power electronic devices was taken as the research object and CFD numerical simulation method was used to study the flow and heat transfer performance of two rib structure.The research results show that the maximum fluid velocity in the diamond rib structure is 1.36 m/s,while the maximum fluid velocity in the cylindrical rib structure is 1.26 m/s,and the flow perform-ance of the diamond rib is better.At the 800 W heat source condition,the heat transfer effect of the cylindrical rib is best,and the highest temperature of the heat source is reduced by about 5％compared with the diamond rib structure.Based on the cylin-drical rib structure,the research finds that the heat transfer performance of the composite structure liquid cooling plate with uni-form temperature chamber is improved by 13.1％compared with the liquid cooling plate without uniform temperature chamber.
Liquid cooling plateFlow heat transfer analysisHigh power densityEnhanced heat transfer
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