Structural optimization of thermoelectric coolers for laser heat dissipation
To maintain the laser chip temperature within the optimal operating range,the internal structure of the thermoe-lectric cooler(TEC)within the heat dissipation module was designed and investigated.A combination of genetic algorithms and the TOPSIS decision-making method was applied for multi-objective optimization of the thermoelectric coupling equations,fo-cusing on cooling capacity and power consumption.The key factors identified were the size factor G and the number of thermoe-lectric legs N.Finite element simulations were conducted to evaluate the effects of these parameters,along with the gap size,on the overall heat dissipation performance.The results show that,within manufacturable limits,increasing G and N while reducing the gap size significantly improves TEC cooling performance,providing theoretical and technical support for efficient laser cool-ing.
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