电源学报2024,Vol.22Issue(1) :133-139.DOI:10.13234/j.issn.2095-2805.2024.1.133

IGBT动态雪崩失效机理仿真分析

Simulation and Analysis of IGBT Dynamic Avalanche Failure Mechanism

关艳霞 刘亭 刘勇 邓杰 王卉如
电源学报2024,Vol.22Issue(1) :133-139.DOI:10.13234/j.issn.2095-2805.2024.1.133

IGBT动态雪崩失效机理仿真分析

Simulation and Analysis of IGBT Dynamic Avalanche Failure Mechanism

关艳霞 1刘亭 1刘勇 1邓杰 1王卉如1
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作者信息

  • 1. 沈阳工业大学信息科学与工程学院,沈阳 110870
  • 折叠

摘要

IGBT在关断过程中所发生的动态雪崩现象是导致其失效的重要原因之一.为研究IGBT动态雪崩失效机理,利用Silvaco软件对其进行仿真分析.通过对动态雪崩击穿机制、电流密度分布和温度分布的仿真分析,得出动态雪崩可以产生移动的电流丝和移动十分缓慢或固定不动的"死丝".引起器件失效的是动态雪崩形成的死丝,死丝会导致IGBT内局部温度的急剧增加,最终因局部温度过高烧毁器件导致IGBT的失效.在此基础上分析了死丝产生的原因并进一步提出防止IGBT动态雪崩失效的具体措施.

Abstract

The phenomenon of dynamic avalanche occurring during the IGBT turn-off process is one of the impor-tant reasons for its failure.To study the dynamic avalanche failure mechanism of IGBT,the Silvaco software was used to simulate and analyze this mechanism.Through the simulation and analysis of the breakdown mechanism,current density distribution and temperature distribution of dynamic avalanche,it is concluded that dynamic avalanche can generate moving current filaments and dead filaments which are either moving slowly or fixed.However,the failure of the device is caused by the dead filaments formed by dynamic avalanche.The dead filaments will lead to a sharp increase of local temperature in the IGBT,and the IGBT will eventually fail because the local temperature is too high to burn the device.On this basis,the causes of dead filaments are analyzed,and specific measures to prevent the dynamic avalanche failure of IGBT are also put forward.

关键词

IGBT/动态雪崩/失效机理/温度/电场

Key words

IGBT/dynamic avalanche/failure mechanism/temperature/electric field

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出版年

2024
电源学报
中国电源学会,国家海洋技术中心

电源学报

北大核心
影响因子:0.7
ISSN:
参考文献量3
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