With the widespread applications of insulated gate bipolar transistors(IGBTs) in power electronic systems, the accurate acquisition of junction temperature which affects their reliability has become crucial. However, one of the main forms of module failure is the aging of the solder layer, which can have a significant impact on the junction tem-perature. To accurately estimate the junction temperature, the advantages of two traditional thermal network models(i.e., Cauer and Foster) are combined in this paper, and an interface method for the two models is studied, so that the combi-nation is completed. The aging of the chip solder layer is taken into account, and a hybrid thermal network model is proposed. Finally, through the comparison of finite element simulation and experimental test with the calculation results of the hybrid thermal network model, it is verified that the hybrid thermal network model can achieve an accurate junc-tion temperature estimation, providing a basis for monitoring the operating status of the module.
关键词
IGBT模块/混合热网络模型/结温估计
Key words
Insulated gate bipolar transistor(IGBT) module/hybrid thermal network model/junction temperature estimation
维普
万方数据